Amkor Technology invites you to join us at the IMPACT 2023 Conference in Taipei, Taiwan at the Taipei Nangang Exhibition Center on October 25-27. IMPACT 2023, which is organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and IC packaging professionals in Taiwan.

Tim Chen, Principal Engineer at Amkor Taiwan will present, “Compact Thermal Model of Flip Chip Lidded BGA Packages Considering the Features of Thermal Interface Materials.”

When: October 25, 2023 - October 27, 2023 Where: Taipei Nangang Exhibition Center Location: Taipei, Taiwan

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