Global Semiconductor and Electronics Forum 2018
Amkor’s Bob Lanzone, Senior VP System in Package Product Line, will present “Advanced Packaging Technologies Enabling Advanced Applications” at the Global Semiconductor & Electronics Forum (GSEF) in Shanghai, China on Thursday, March 8th at 16:15.
The presentation will cover the following:
- Market drivers and requirements for Advanced System in Package
- Advanced System in Package technology roadmaps
- Overview of newly developed key enabling technologies
- Package Miniaturization, Double Sided Assembly, Conformal and Compartmental Shielding