Global Semiconductor and Electronics Forum 2018

Amkor’s Bob Lanzone, Senior VP System in Package Product Line, will present “Advanced Packaging Technologies Enabling Advanced Applications” at the Global Semiconductor & Electronics Forum (GSEF) in Shanghai, China on Thursday, March 8th at 16:15. 

The presentation will cover the following:

  • Market drivers and requirements for Advanced System in Package
  • Advanced System in Package technology roadmaps
  • Overview of newly developed key enabling technologies
  • Package Miniaturization, Double Sided Assembly, Conformal and Compartmental Shielding
When: March 7, 2018 - March 9, 2018 Where: Pudong Xinqu, Shanghai, China Location: The Grand Kempinski Hotel Shanghai

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