Global Semiconductor and Electronics Forum 2018
Amkor’s Bob Lanzone, Senior VP System in Package Product Line, will present “Advanced Packaging Technologies Enabling Advanced Applications” at the Global Semiconductor & Electronics Forum (GSEF) in Shanghai, China on Thursday, March 8th at 16:15.
The presentation will cover the following:
- Market drivers and requirements for Advanced System in Package
- Advanced System in Package technology roadmaps
- Overview of newly developed key enabling technologies
- Package Miniaturization, Double Sided Assembly, Conformal and Compartmental Shielding
When: March 7, 2018 - March 9, 2018
Where: Pudong Xinqu, Shanghai, China
Location: The Grand Kempinski Hotel Shanghai
近日開催予定のイベント
2024年第2四半期 Amkor Technology業績発表に関するカンファレンスコール
IEEE ESTC 2024
