Join Amkor Technology at the upcoming EuroSimE 2020 Virtual Event on July 6-27, 2020.
Amkor is a co-author of a paper being presented by Fraunhofer ENAS: “Virtual Prototyping, Design for Reliability and Qualification for a Full System in Package (SiP) Product Portfolio of a Fan-out Wafer Level Package (FOWLP) Line”
Ghanshyam Gadhiya1,2, Heikki Kuisma3, André Cardoso4, Birgit Brämer1, Sven Rzepka1,2, Thomas Otto1,2
1Fraunhofer ENAS, Dept. Micro Materials Center, Chemnitz, Germany
2Chemnitz University of Technology, Chemnitz, Germany
3Murata Electronics Oy, Vantaa, Finland
4Amkor Technology Portugal S.A., Porto, Portugal