Events

EuroSimE 2020

Join Amkor Technology at the upcoming EuroSimE 2020 Virtual Event on July 6-27, 2020.

Amkor is a co-author of a paper being presented by Fraunhofer ENAS: “Virtual Prototyping, Design for Reliability and Qualification for a Full System in Package (SiP) Product Portfolio of a Fan-out Wafer Level Package (FOWLP) Line”

Authors:

Ghanshyam Gadhiya^1,2, Heikki Kuisma³, André Cardoso⁴, Birgit Brämer¹, Sven Rzepka^1,2, Thomas Otto^1,2

¹Fraunhofer ENAS, Dept. Micro Materials Center, Chemnitz, Germany
²Chemnitz University of Technology, Chemnitz, Germany
³Murata Electronics Oy, Vantaa, Finland
⁴Amkor Technology Portugal S.A., Porto, Portugal