Amkor Technology invites you to join us at ECTC 2024 on May 28-31 in Denver, Colorado at the Gaylord Rockies Resort & Convention Center. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Amkor is presenting the following:
“New Double Side Molded Package Platform Development With Open Cavity Mold On One Side And Exposed Die Mold On The Other Side”
MiKyoung Choi, Sr. Dir, Product Development – Amkor Technology Korea
“Thermal Performance, ThetaJC, of In Alloy TIM under EOL, TC, HTS”
SangHyuk Kim, Mgr, Process/Material Research – Amkor Technology Korea
“Fusing Current Characterization Of Various Cu RDL Designs In Wafer Level Packaging”
JeongMin Ju, Mgr, Process/Material Research – Amkor Technology Korea
“FCmBGA Package Platform for Highly Reliable Automotive Applications”
InRak Kim, Sr. Mgr, Product Development – Amkor Technology Korea
Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.