Join Amkor Technology at the upcoming CSIA-ICCAD conference on December 22-23, 2021 at the Wuxi Taihu International Expo Center in Wuxi, China. Amkor will be exhibiting with our packaging experts on hand to answer questions and discuss your IC packaging needs.

Bibby Wang, Deputy Director, Greater China Sales & Marketing and Mike Kelly, VP, Advanced Package & Technology Integration at Amkor Technology, will be presenting “Heterogeneous IC Packaging for AI and Compute.

When: December 22, 2021 - December 23, 2021 Where: Wuxi, China Location: Wuxi Taihu International Expo Center

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