China International Semiconductor Packaging and Testing Conference

Amkor Technology invites you to join us at the China International Semiconductor Packaging and Testing Conference on March 18-19, 2024.

Charlie Zhao, Director, TPM at Amkor China, will present “Chiplets and System Integration – Key Concepts and Implementation.

Abstract:

In this presentation, Charlie Zhao, Director of Technical Program Management (TPM) at Amkor Technology, Inc. discusses the key concepts and implementations of chiplets and system integration. Charlie highlights the strong trends in chiplets and heterogeneous integration products, which offer new ways to achieve innovative product architectures while maintaining optimal Performance/Power/Area/Cost (PPAC) ratios for the future of the industry. Charlie emphasizes the need for advanced IC packaging capabilities to support these approaches and notes that OSATs and Foundries are actively responding to enable this integration. The presentation emphasizes the importance of starting with a 2D module and augmenting it with 3D as necessary for enhanced performance and differentiation. Additionally, Charlie mentions Amkor’s involvement as a contributor member of the UCIe™ ecosystem, which aims to define next-generation computing standards. Overall, this presentation provides valuable insights into the evolving landscape of chiplets and system integration.

When: March 18, 2024 - March 19, 2024 Where: Pudong, Shanghai Location: Pudong, Shanghai

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