AMO Virtual Workshop Series on Semiconductor R&D for Energy Efficiency
Join Amkor Technology for a 2-day virtual webinar on Semiconductor R&D for Energy Efficiency: Workshop 4 Advanced Packaging for Energy Efficient Microelectronics on January 12-13, 2022, 12:30-3:30 PM EST, Hosted by the U.S. Department of Energy Advanced Manufacturing Office with the National Institute of Standards and Technology (NIST). This webinar will be focused on emerging technologies and opportunities to overcome key barriers in advanced packaging to improve the energy efficiency of 3D microelectronics.
Mike Kelly, VP, Adv Package & Technology Integration at Amkor will be a panelist during the session: “Thermal Management for 3D Microelectronics” on January 12 from 1:40 – 2:10 PM EST. There will be a Q&A following the session from 2:10 – 2:40 PM EST.
Panel moderator: Paul Syers, DOE AMO
Additional panelists include:
- Muhannad Bakir, Georgia Institute of Technology
- Ravi Mahajan, Intel
- Ganesh Subbarayan, Purdue University