ISIG 中国高层峰会

Amkor will be attending the ISIG Executive Summit China, a senior‑level forum that brings together semiconductor executives and technology leaders from across China and the global electronics ecosystem. The summit focuses on strategic discussions around semiconductor manufacturing, packaging, and test innovation, supply chain development, and the evolving requirements of advanced and specialty applications.

Amkor team members will be on-site throughout the two‑day event, engaging with industry peers, customers, and partners across the semiconductor value chain.

We welcome the opportunity to connect and discuss how Amkor’s advanced packaging and test expertise can support your technology roadmap and business objectives.

When: October 20, 2026 - October 21, 2026 Where: TBC 地点:重庆,中国

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