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ISIG Executive Summit China

Amkor will be attending the ISIG Executive Summit China, a senior-level forum that brings together semiconductor executives and technology leaders from across China and the global electronics ecosystem. The summit focuses on strategic discussions around semiconductor manufacturing, packaging and test innovation, supply chain development, and the evolving requirements of advanced and specialty applications.

As part of the event program, Jun Wang, Senior Vice President of Manufacturing & Engineering, and Jianmin Li, Senior Director of Manufacturing & Engineering, will share insights into the latest packaging and test technologies and Amkor’s expertise in enabling next-generation semiconductor solutions. Amkor team members will be on-site throughout the two-day event, engaging with industry peers, customers, and partners across the semiconductor value chain.

Through collaboration with customers, partners, and industry leaders, Amkor continues to drive innovation in semiconductor packaging and test technologies, strengthen the global semiconductor ecosystem, and support the advancements shaping the future of the industry while advancing what’s next.