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ISIG Executive Summit China

Amkor will be attending the ISIG Executive Summit China, a senior-level forum that brings together semiconductor executives and technology leaders from across China and the global electronics ecosystem. The summit focuses on strategic discussions around semiconductor manufacturing, packaging and test innovation, supply chain development, and the evolving requirements of advanced and specialty applications.

As part of the event program, Jun Wang, Senior Vice President of Manufacturing & Engineering, and Jianmin Li, Senior Director of Manufacturing & Engineering, will share insights into the latest packaging and test technologies and Amkor’s expertise in enabling next-generation semiconductor solutions.

Amkor team members will be on-site throughout the two-day event, engaging with industry peers, customers, and partners across the semiconductor value chain.

We welcome the opportunity to connect and discuss how Amkor’s deep packaging and test expertise can support your technology roadmap and business objectives.