活动

EPTC 2022

Amkor Technology 邀请您和我们一起参加 12 月 7-9 日在新加坡国敦河畔大酒店 (Grand Copthorne Waterfront Hotel) 举行的第 24 届 Electronics Packaging Technology Conference (EPTC 2022)及其活动。

Amkor 很荣幸作为赞助商并发表以下演讲：

“A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability”
Geondu Gim、Jongmin Bark、Hunjung Lim 及 Gookjin Jung， Amkor Technology Korea

“High Electrical Performance Multi-chip Leadframe Package With Internal Connection”
DaeYoung Park、HyeongIl Jeon、GiJeong Kim、JiYeon Yang、KwangSoo Sang、ByongJin Kim 及 JinYoung Khim，Amkor Technology Korea

“Reverse Laser-Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate”
SeokHo Na、MinHo Gim、GaHyeon Kim、DongSu Ryu、DongJoo Park 及 JinYoung Kim，Amkor Technology Korea