EPTC 2022

Amkor Technology invites you to join us at the 24th Electronics Packaging Technology Conference (EPTC 2022) event on December 7-9 at the Grand Copthorne Waterfront Hotel in Singapore.

Amkor is a proud sponsor and will be presenting the following:

A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability
Geondu Gim, Jongmin Bark, Hunjung Lim, Gookjin Jung, Amkor Technology Korea

High Electrical Performance Multi-chip Leadframe Package With Internal Connection
DaeYoung Park, HyeongIl Jeon, GiJeong Kim, JiYeon Yang, KwangSoo Sang, ByongJin Kim, JinYoung Khim, Amkor Technology Korea

Reverse Laser-Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate
SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park and JinYoung Kim, Amkor Technology Korea

When: December 7, 2022 - December 9, 2022 Where: Grand Copthorne Waterfront Hotel Location: Singapore

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