Amkor Technology invites you to join us at the 24th Electronics Packaging Technology Conference (EPTC 2022) event on December 7-9 at the Grand Copthorne Waterfront Hotel in Singapore.
Amkor is a proud sponsor and will be presenting the following:
“A Study on Combination of ENEPIG Surface Finish and Solder Ball for Solder Joint Reliability”
Geondu Gim, Jongmin Bark, Hunjung Lim, Gookjin Jung, Amkor Technology Korea
“High Electrical Performance Multi-chip Leadframe Package With Internal Connection”
DaeYoung Park, HyeongIl Jeon, GiJeong Kim, JiYeon Yang, KwangSoo Sang, ByongJin Kim, JinYoung Khim, Amkor Technology Korea
“Reverse Laser-Assisted Bonding (R-LAB) Technology for Chiplet Module Bonding on Substrate”
SeokHo Na, MinHo Gim, GaHyeon Kim, DongSu Ryu, DongJoo Park and JinYoung Kim, Amkor Technology Korea