ISIG 日本高层峰会

Amkor will be attending the ISIG Executive Summit Japan, a senior‑level forum that convenes semiconductor executives and technology leaders from across Japan and the global semiconductor ecosystem. The summit features strategic discussions on advanced semiconductor manufacturing, packaging innovation, supply chain collaboration, and the technology trends shaping next‑generation applications.

Amkor team members will be on-site throughout the two‑day event, engaging with industry peers and partners across the semiconductor value chain.

We welcome the opportunity to connect and discuss how Amkor’s advanced packaging and test expertise can support your technology roadmap and business objectives.

When: December 3, 2026 - December 4, 2026 Where: TBC 地点:日本东京

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