活动

中国国际半导体高层峰会

Amkor Technology is pleased to be part of the CISES 2019 event being held in Shanghai on September 5-6.

Amkor 将发表下列演讲：

Sept 5 – 11:45-12:05 (Advanced Packaging Session)
“Advanced Packaging: The Rise of Heterogeneous Integration“, Curtis Zwenger, VP, Adv Package & Technology Integration

Sept. 6 – 14:45-15:05 (Automotive Session)
“Automotive Semiconductor Packaging – Where Are We Headed?“, Curtis Zwenger, VP, Adv Package & Technology Integration

Curtis Zwenger will also be a panelist during the panel discussion moderated by Merck on Friday, September 6 from 15:20-15:50.

来自世界各地的半导体行业高管将齐聚中国国际半导体高峰论坛，讨论与大中华区有关的问题。