活动

第 22 届 Electronics Packaging Technology Conference

Amkor Technology 邀请您和我们一起参加 2020 年 12 月 2-4 日在新加坡举办的第 22 届 Electronics Packaging Technology Conference (EPTC 2020) 及其活动。

Amkor 将发表下列演讲：

“Wafer Level Void-Free Molded Underfill for High-Density Fan-Out Packages”
InSu Mok、JaeHun Bae、WonMyoung Ki、HoDol Yoo、SeungMan Ryu、SooHyun Kim、GyuIck Jung TaeKyeong Hwang 和 WonChul Do，Amkor Technology, Inc.

“Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications”
JaeYoon Kim、KyeRyung Kim、EunYoung Lee、SeHwan Hong、JuHong Shin、Ji Hun Lee、David Hiner、WonChul Do，Amkor Technology, Inc.