22nd Electronics Packaging Technology Conference
Amkor Technology invites you to join us at the 22nd Electronics Packaging Technology Conference (EPTC 2020) event on December 2-4, 2020 in Singapore.
Amkor will be presenting the following:
“Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages”
InSu Mok, JaeHun Bae, WonMyoung Ki, HoDol Yoo, SeungMan Ryu, SooHyun Kim, GyuIck Jung TaeKyeong Hwang, and WonChul Do, Amkor Technology, Inc.
“Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications”
JaeYoon Kim, KyeRyung Kim, EunYoung Lee, SeHwan Hong, JuHong Shin, Ji Hun Lee, David Hiner, WonChul Do, Amkor Technology, Inc.