职业 – 马来西亚

工作职责：

• Develop and implement strategies to optimize facility layout and utilization
• Analyze space usage and identify improvement opportunities
• 对整个工厂进行产能时间研究和生产线平衡
• 分析和模拟产能提升项目的生产能力
• Lead operation team for machine utilization increment projects
• 领导工业工程和自动化团队开展数据和报告自动化项目
• 负责分析和监控工厂的数据准确性
• Collaborated with the R&D & Finance team in simulating new business equipment and tool requirements

职位要求：

• Candidate must possess at least a Degree in Engineering or equivalent
• At least 3 years of working experience in the related fast-paced manufacturing environment is required for this position
• Knowledge in layout and capacity planning, utilization analysis and IE improvement tools as an added advantage
• Proficient in AutoCAD and Microsoft Office (Excel, PowerPoint)
• 有条理，系统性强，注重细节，善于解决问题
• 欢迎应届毕业生申请此职位
• 申请人必须愿意在雪兰莪州 Telok Panglima Garang (FIZ) 工作

感兴趣的应聘者可以将简历发送至 Recruitment@amkor.com

工作职责：

• Plan, lead and manage package and process improvement and development activities
• Review customers’ new product spec requirements and follow up implementation where applicable
• Research, evaluate and propose materials and equipment suitable to support new product development
• Study and identify department staff’s technical skill requirements
• Effectively communicate company /department direction to respective staff in the department
• Follow up department staff’s compliance on quality, environmental, safety and health programs and activities in the company
• Performs any other functions and activities as may be assigned by supervisor from time to time

职位要求：

• Candidate should possess at least a Masters/Bachelor’s Degree in Engineering (Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology, Material science) or equivalent
• Preferably more than 10 years in semiconductor backend (FOL & EOL) manufacturing/NPI/process & package development experience
• Experienced in lead frame/power packaging design and technology
• Experienced in semiconductor backend material, equipment, process & package development & project management
• 熟悉行业的常用设备/技术，熟悉新封装开发的设备功能
• Design/simulation/FA hands-on experience will be an added advantage
• Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT, etc.
• Good leadership, written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
• 申请人必须愿意在雪兰莪州 Telok Panglima Garang (FIZ) 工作

感兴趣的应聘者可以将简历发送至 Recruitment@amkor.com

工作职责：

• Source materials and equipment that meet the required quality standards at the most competitive prices
• Negotiate with suppliers and lead cost-reduction initiatives to achieve defined cost-saving targets
• Develop and execute material requirement planning (MRP) to ensure timely and uninterrupted supply of materials
• Oversee inventory management to maintain optimal stock levels while minimizing excess and obsolescence
• Manage vendor relationships, including conducting audits, evaluating performance, and driving continuous improvement programs
• Collaborate with the business development team to support new projects from a procurement perspective
• Oversee Supplier Product Change Notifications (SPCN) to ensure smooth transitions and minimal impact on production
• Lead and mentor the procurement team to achieve departmental KPIs and contribute to overall company goals

职位要求：

• A Bachelor’s Degree in Engineering or a related field is required
• Minimum of 10 years of relevant procurement experience, preferably within the Semiconductor OSAT or multinational corporation (MNC) environment
• Proven expertise in vendor management with excellent communication and relationship-building skills
• Proficient in SAP, particularly in the Materials Management (MM) module
• Strong negotiation skills with a demonstrated track record of successful cost-reduction strategies
• In-depth knowledge of material requirement planning (MRP) and inventory management best practices
• Strong analytical skills and a high level of numerical proficiency
• Proficient in Microsoft Office, particularly Excel and PowerPoint
• Highly organized, systematic, and detail-oriented with strong problem-solving abilities
• Willingness to work in Telok Panglima Garang (FIZ), Selangor

感兴趣的应聘者可以将简历发送至 Recruitment@amkor.com

工作职责：

• Managing the execution of the new package development project according to business process guidelines, to meet project milestones, quality & cost requirements
• Plan, organize and control the project with full responsibility for all operational decisions in the project
• Responsible for Engineering Samples, Qualification and safe launch builds, and proper handover to manufacturing
• Break down the project complexity to transparently report the status of the project to the project owner, and upper management and diligently to customers
• Prepare respective business cases and forward-looking risk assessments timely to facilitate management decisions and consequence management
• Responsible for overseeing customer audits and all issues related to the projects. Communicate effectively to gain support from all stakeholders

职位要求：

• Minimum 3 years working experience as Project Leader in Semiconductor Package Development
• Broad knowledge of overall Semiconductor FOL and EOL manufacturing processes
• Familiar with the development of Power packages (PQFN, TOLL, LFPAK, etc) an added advantage
• Excellent Project Management, Organizational and Interpersonal Skills in managing semiconductor new package development projects
• Ability to prioritize multiple activities and make effective decisions in support of a compact project plan, using sound communication skills, influencing power and negotiation skills both internally and externally with all stakeholders
• 良好的书面和口头表达能力。能提出想法、概念和数据，并在团队会议和行政审查会议上自信地制定计划
• 申请人必须愿意在雪兰莪州 Telok Panglima Garang (FIZ) 工作

教育：

• Bachelor’s or Master’s in Engineering (Mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Semiconductor Technology, Material science) or equivalent.

感兴趣的应聘者可以将简历发送至 Recruitment@amkor.com

工作职责：

• 处理异常批次处置，确定故障分析方法，分析结果并做出判断，包括在批次处理过程中与客户建立良好的沟通，以规避装运质量风险
• 支持工艺效率和效益改善活动
• 领导团队就内部或外部审计问题向相关部门做出回应，包括协调其他部门支持项目的结案工作
• 负责建立、改进和维护制造操作 SOP，减少/消除不同班次的操作差异，以提升并获得稳定的制造能力
• 管理小批量制造 (LVM)，应对生产线引入的任何新变化（包括初始启动的准备工作），以管理新引入项目的质量和可制造性风险
• 负责领导改进、维护工艺流程、控制计划以及 FMEA，这些输入可能来自风险管理、改进活动、申领、审计结果或内部流程

职位要求：

• 至少 2 年在类似半导体制造领域具有同等领导能力的工作经验，通过测试流程获得 TnF 工作经验者优先
• 拥有将产品从小批量生产转为大批量生产的经验者优先
• 能够在最低限度的监督下独立执行任务，并具备整个半导体装配流程的基本知识以及对汽车要求的了解
• 具有较强的分析能力、SPC 问题解决能力、熟悉 8 原则、Why-Why 分析、故障树分析和 DOE 的团队合作者优先
• 精益制造、六西格玛和 ISO/TS 标准方面的知识和经验
• 欢迎应届毕业生申请此职位
• 申请人必须愿意在雪兰莪州 Telok Panglima Garang (FIZ) 工作

教育：

• 应聘者应至少拥有工程（机械、电子、制造或材料工程）或类似学科的学位或硕士学位
• 应届毕业生亦可申请此职位

感兴趣的应聘者可以将简历发送至 Recruitment@amkor.com