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Amkor’s 2.5D TSV technology is revolutionizing the high-performance computing (HPC) sector and artificial intelligence (AI) applications. But what makes 2.5D TSV so groundbreaking? This technology allows for integrating different components on a TSV-bearing silicon substrate using redistribution layers (RDL) wafer-level processing. Amkor’s packaging solutions achieve unmatched performance by interconnecting logic chips and high-bandwidth memory in close proximity.

This integration enhances bandwidth, reduces power consumption, and improves electrical performance, making it perfect for data-intensive tasks like AI algorithms. As AI shapes our world, the need for efficient processing power grows exponentially. Amkor’s 2.5D TSV technology accelerates AI workloads by seamlessly combining memory and logic, resulting in faster computations and smarter decision-making.

Examples of 2.5D TSV products shown below demonstrate Amkor’s production capabilities.

Amkor has been engaged in high-volume manufacturing (HVM) for chip-on-substrate (CoS) since 2016 and for chip-on-wafer (CoW) since 2019.

Amkor’s commitment to excellence goes beyond technology; it’s about meeting the industry’s ever-evolving needs. To this end, the company is tripling its 2.5D TSV production capabilities. This capacity expansion, set to be completed by Q4 2024, positions Amkor as a key player in the semiconductor landscape. Amkor recently shipped its two millionth 2.5D TSV product, marking a significant milestone in the industry. These innovative products are essential for powering cutting-edge applications in AI, HPC, and beyond. From self-driving cars to medical diagnostics, AI relies on robust computing power, and Amkor’s 2.5D TSV technology enables AI systems to process vast amounts of data efficiently. Additionally, high-performance computing demands speed, precision, and scalability, and Amkor’s advanced technology ensures that HPC clusters operate optimally, driving scientific breakthroughs and complex simulations.

Amkor’s 2.5D TSV technology has been pivotal in advancing AI capabilities. Looking ahead, our capacity expansion will solidify our position as leaders in cutting-edge solutions. Amkor’s journey is not just about developing chips—it’s about shaping the future. With a steadfast focus on quality, reliability, and performance, Amkor drives technology and innovation forward, one TSV at a time.