Challenges of Heterogeneous Integration

August 7, 2023 in Semiconductor Story by Amkor Marcom

Heterogeneous integration opens the door to an almost unlimited number of features in a single package, but it also adds system-level challenges into a small space filled with a whole spectrum of possible interactions. Mike Kelly, Vice President of Chiplets/FCBGA Integration at Amkor Technology, talks to Semiconductor Engineering about a variety of issues ranging from uneven aging, warpage, and different mechanical stresses, as well as some possible benefits.