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Automotive electronics encompasses a variety of products – from body electronics and access systems to engine, lighting and infotainment components. Amkor offers an industry-leading portfolio of automotive packaging technologies including:

  • Low-Cost Flip Chip
  • Wafer Level Chip Scale Packaging (WLCSP)
  • System-in-Package (laminate/wafer-based)
  • MEMS and Sensor
  • Leadframe
  • Power Discrete

 

Enabling the future of automotive

The automotive industry is going through a revolution, and with this growth comes opportunities for stakeholders to add economic value to end users. Several environmental, economic and social factors are influencing future electric vehicle designs, safety and powertrain choices. Whether it’s ADAS, infotainment or electrification applications, performance and reliability aspects shape each player’s strategy.

Semiconductor suppliers, including OSATs, offer packaging technologies that are cutting edge, reliable and cost effective to realize various functional ability for evolving automotive applications. Amkor is the leading automotive OSAT for providing turnkey solutions, including wafer sort, bump services, packaging, test and burn-in, to meet aggressive go-to-market plans. Amkor’s factories are IATF16949 certified and adhere to highest levels of quality controls.

차대 전자기기

The chassis is the structural framework of a vehicle to which the body (and related components) are mounted. Chassis electronics are compact and robust to ensure the safety of drivers, passengers and cargo.

Package Types:

사례:

  • Anti-lock braking system
  • Suspension
  • Steering control
  • Tire pressure monitoring

적용된 기술:

  • Inertial, pressure and other sensors
  • A/D and D/A converters
  • Transceivers
  • Level and roll control

xEV

xEV solutions refer to power components that help in power conversion from battery to electric drive motors, on-board charging of DC batteries and DC-DC conversion to 12V/24V systems.

Package Types:

사례:

  • Traction inverter
  • On-board charger
  • Battery management systems

적용된 기술:

  • Power conversion
  • DC-DC step up/step down

주행안전

Vehicle sensor systems that alert drivers to hazardous conditions or potential harm are vital for driving safety.

Package Types:

사례:

  • Airbags
  • TPMS
  • Event data recorder

적용된 기술:

  • MCUs
  • Sensors
  • Amplifiers

차체 전자기기

중앙차체제어 시스템은 안전, 전원관리 및 차량진단 시스템 일체를 모두 관장합니다.

Package Types:

사례:

  • Climate control
  • Doors/seats
  • Entry/exit
  • Lighting

적용된 기술:

  • LEDs and LED drivers
  • PMICs
  • NFC and connecters (CAN/LIN, Ethernet buses)

Infotainment & Telematics

Vehicles utilize a variety of hardware and software products that help enhance driver and passenger experience as well as enable safety and connectivity features.

Package Types:

사례:

  • Display (in-panel and head-up)
  • Navigation systems
  • Vehicle to everything (V2X)
  • Audio
  • 보안

적용된 기술:

  • SoCs
  • PMICs, RFICs
  • Sensors
  • LED drivers
  • Touch screen controllers
  • CAN transceivers
  • MCUs

첨단 운전자 지원 시스템

Advanced Driver Assistance Systems (ADAS) automate some aspects of the driving process, such as parking assistance, lane positioning and collision avoidance. ADAS systems use multiple sensors such as cameras, radar, LiDAR and ultrasonic sensors to improve the safety of the vehicle.

Package Types:

사례:

  • Automatic emergency braking
  • Adaptive cruise control
  • Collision warning
  • Lane keep assist
  • Parking assist

적용된 기술:

  • SoCs
  • CMOS image sensors
  • mmWave radar
  • LIDAR
  • PMICs
  • MCUs

구동장치

Powertrain refers to primary components, such as the engine, transmission and drive shafts, tasked with generating power and delivering it where needed for successful vehicle operation. Powertrain semiconductors are used in managing and reducing fuel consumption and emissions.

Package Types:

사례:

  • Engine computer
  • Fuel injection
  • Start-stop systems
  • Electric motor control
  • 배터리 관리

적용된 기술:

  • MCUs
  • Sensors
  • Transceivers & Connectors (CAN/LIN, Ethernet buses)

Q & A

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