Thank you for visiting us at CHIPcon 2023!
Below are the related documents to topics Amkor presented at the conference.
Where technology, capacity and service come together to enable the future of electronics
Amkor has a broad product and technology offering allowing us to be a single source for our customers
If you can build it, Amkor can test it!
Amkor – the world’s largest OSAT for automotive ICs
Leaders in next generation package design
Ideal solutions for low cost integration at a smaller size
Increase integration with a reduced footprint
Double Sided Molded BGA allows molded assembly of components on both sides of the substrate
Flexibility to enable 3D multi-component package designs
Enable higher semiconductor content in a high performing, small sized package
Cutting-edge solutions for 5G applications
Amkor is the world leader in optical sensor packaging technology
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