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Below are the related documents to topics Amkor presented at the conference.

Link to Amkor Corporate Overview Brochure

Corporate Overview Brochure

Where technology, capacity and service come together to enable the future of electronics

Link to Amkor Product Line Card

Product
Line Card

Amkor has a broad product and technology offering allowing us to be a single source for our customers

Link to Amkor Test Services Brochure

Test Services
Brochure

If you can build it, Amkor can test it!

Link to Amkor Automotive Brochure

Automotive
Brochure

Amkor – the world’s largest OSAT for automotive ICs

Link to Design Center Brochure

Design Center Brochure

Leaders in next generation package design

Link to System in Package Data Sheet

System in Package Data Sheet

Ideal solutions for low cost integration at a smaller size

Link to SWIFT and HDFO Data sheet

SWIFT®/HDFO
Data Sheet

Increase integration with a reduced footprint

Link to Amkor DSMBGA Data Sheet

DSMBGA
Data Sheet

Double Sided Molded BGA allows molded assembly of components on both sides of the substrate

Link to Amkor WLFO Wafer Level Fan-Out Data Sheet

WLFO/WLCSP+
Data Sheet

Flexibility to enable 3D multi-component package designs

Link to Amkor WLCSP Wafer Level CSP Data Sheet

WLCSP
Data Sheet

Enable higher semiconductor content in a high performing, small sized package

Link to Antenna in Package (AiP) Data Sheet

AiP/AoP
Data Sheet

Cutting-edge solutions for 5G applications

Link to Amkor Optical Packaging Data Sheet

Optical Sensors
Data Sheet

Amkor is the world leader in optical sensor packaging technology

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