Thank you for visiting us at ECTC!

Below are the related documents to topics Amkor presented at the conference.

Corporate Overview Brochure

Where technology, capacity and service come together to enable the future of electronics

Product Line Card

Amkor has a broad product and technology offering allowing us to be a single source for our customers’ total IC packaging requirements

Test Services Brochure

If you can build it, Amkor can test it!

Automotive Brochure

Amkor – the world’s largest OSAT for automotive ICs

FCBGA Data Sheet

Design flexibility for a wide range of end applications

System in Package Data Sheet

Ideal solutions for low cost integration at a smaller size

SWIFT®/HDFO
Data Sheet

Increase integration with a reduced footprint

DSMBGA Data Sheet

Double Sided Molded BGA allows molded assembly of components on both sides of the substrate

WLFO Data Sheet

Flexibility to enable 3D multi-component package designs

WLCSP Data Sheet

Enable higher semiconductor content in a high performing, small sized package

AiP/AoP Data Sheet

Cutting-edge solutions for 5G applications

Optical Sensors
Data Sheet

Amkor is the world leader in optical sensor packaging technology

Questions?

Contact an Amkor expert by clicking the request info button below.