Amkor Virtual Booth

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Below are the related documents to topics Amkor presented at the conference.

Where technology, capacity and service come together to enable the future of electronics

Where technology, capacity and service come together to enable the future of electronics

If you can build it, Amkor can test it!

Amkor – the world’s largest OSAT for automotive ICs

Amkor is a market leader in providing innovative packaging and test services to the memory IC market

Amkor Technology is a top OSAT for MEMS and optical sensor packaging and test services

Ideal solutions for low cost integration at a smaller size

Increase integration with a reduced footprint

Double Sided Molded BGA allows molded assembly of components on both sides of the substrate

Design flexibility for a wide range of end applications

Flexibility to enable 3D multi-component package designs

Enable higher semiconductor content in a high performing, small sized package

Cutting-edge solutions for 5G applications

Amkor is the world leader in optical sensor packaging technology

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