Test Solutions

Amkor is the number one automotive OSAT, supporting worldwide supply chains. Products in this area include infotainment and safety requiring high levels of performance. This requires a much more comprehensive set of test requirements.

• Cold wafer probe and perform room & hot temperature final test
• High-quality, standards-compliant processes and systems
• Inspections and tri-temperature multi-temperature test capabilities
  • Burn-in
  • Final test at -55°C to +175°C
  • System Level Test (SLT)
  • Wafer probe at -55°C to +200°C
• Post assembly final test with outgoing post assembly opens/shorts testing, includes 2 and 4 wire resistance tests

Over 38% of Amkor’s revenue is derived from Communications (smartphones, tablets, handhelds and wearable devices). Our leading-edge test solutions keep pace with rapid changes in cellular and connectivity technology requirements. Amkor is already well-positioned for 5G wireless and its new test requirements working with leading customers and ATE suppliers, we have 5G RF test capability in place.

• 5G NR Conductive test for both FR1 and FR2 Frequency Ranges
• Asynchronous test for different RF connectivity standards
• ATE coverage with SLT (protocol test)
• ATE w/32 port and multi-site, multi-channel Tx & Rx support
• Complex SiP with simple SLT, including RF callbox testing
• Local RF shielding ≤60 dBm
• Multi-site x8 RF test to lower cost
• RF Front End (RFFE), SiP & IoT
• RF wafer probe capabilities – known good die (KGD) for WLCSP and known tested die (KTD) for SiP
• Single and multiple channel beamforming, phased array, AiP/AoP support
• SoC + Memory PoP – double side test/stack CSP – memory and logic test

Amkor is a leading provider of high-performance test solutions for the demanding networking and computing market – where five nines (99.999%) or higher uptime is expected. We have multiple customers supplying SiP(s), SoC(s) and components into these markets (servers, routers, switches, PCs, laptops and peripherals). Integral to these markets are storage technology and migrations from hard disk drives to solid-state drives (SSD). In addition, Amkor has a strong array of NAND test capabilities.

• Active thermal control for 300-watt products across tri-temperature in SLT and ATE test
• Distributed test (wafer probe, in-situ test between key assembly steps and final test (SLT and ATE) for 2.5D)
• Dynamic burn-in
• Film frame and strip test (x308 EEPROM)
• High-speed serial digital (e.g. PCIe Gen4, Gen5) testing up to 16 Gbps and 32 Gbps
• Probe solutions and wafer map management for Chip on Wafer (CoW)
• Silicon Photonics ICs
• Test during burn-in (TDBI)

Amkor is a leader in power discrete devices, with test services that are closely integrated with assembly flow for shorter cycle times and reduced costs. Unique requirements include:

• Adequate thermal capacity
• High current, high voltage
• Kelvin contact-type tests
• Low Rds_on
• SiC, GaN module test

High-volume products at Amkor include:

• Diodes
• Flip chip MOSFETs
• Intelligent power modules
• Insulated-Gate Bipolar Transistors (IGBT)
• Multi-voltage FETs
• Regulators and bipolar transistors for the automotive, power transmission and industrial segments

Products for today’s Internet of Things (IoT) and Industrial Internet of Things (IIoT) require an MCU, RF transmitter/receiver, sensors and actuators. The test solution needs to cover the conversion of physical real-world analog signals into electrical data and processing of the data to determine if the product is good or not.