If you can build it, Amkor can test it!
With the knowledge gathered from decades of supporting Tier 1 leaders and emerging industries, Amkor understands that test solutions must address advanced technology, quality, performance and cost of test. Through early engagement in each customer’s product lifecycle, Amkor helps define test strategies and intelligent equipment selection to provide differentiated test solutions.
Amkor’s comprehensive test services complement wafer level and package assembly. In addition, Amkor is the leading RF test services supplier for sub-6 GHz and is engaged in ongoing joint efforts with test equipment suppliers and customers to enable 5G product production testing. As the top OSAT supplier for automotive and artificial intelligence processor testing, we have an extensive array of test capabilities and significant experience in device testing.
- >10 Billion units tested annually
- >1 Million wafers tested annually
- >2300 testers in 7 countries
- Full end-of-line processing: Bake, scan, pack, ship and finished good services
- Strip test: Leadframe, film frame, in-carrier
- Test development: Software & hardware for probe, strip, final test and SLT
- Testing for commercial, industrial & automotive devices
- Discrete, power, mixed-signal, memory, RF, MEMS and System in Package (SiP) devices
- Wafer probe, burn-in, final test, SLT
Introducing Amkor’s New Lancaster-V1
Amkor proudly unveils its cutting-edge in-house boundary-scan tester (BST), known as the Lancaster-V1. Crafted by our proficient test engineering teams, these boundary scan solutions have been meticulously engineered to conduct 1149.1 tests within the in-circuit test environment, all under FPGA control. The Lancaster-V1 leverages existing tester instrumentation hardware to seamlessly apply BST vectors, elevating the overall test fault coverage. Notably, the execution of boundary scan tests is achieved without the need for supplementary hardware, such as conversion kits or power supplies. This is another testament to Amkor’s commitment to innovation and efficiency in testing.
Targeted Applications
- Digital – ASIC, datacom, FPGA, ADAS controllers, chipsets, graphic and application processors and microcontrollers
- SoC & SiP – Mixed signal, audio/video processors, ADC/DAC, PMIC and MCM
- The Lancaster V1 is perfect for customers looking for a dependable, low-cost, reduced test-time solution
AMT4000 Tester
The AMT4000 tester can test OS/DC (ISVM, VSIM and resistance measure) and offers advanced options such as a socket and reliability tester, probe card checker and a capacitance measure unit. Additional features include flexible channel configurations (512-4096), utility channels (GPIO, user power and board ID), easy test program structures, customized PGM, user-friendly interface, compact size, and easy installation and maintenance. Amkor’s AMT4000 offers up to a 40% reduction in test costs and product time to market for Amkor’s customers.
Targeted Applications
- Digital – ASIC, datacom, FPGA, ADAS controllers, chipsets, graphic and application processors and microcontrollers
- SoC & SiP – Mixed signal, audio/video processors, ADC/DAC, PMIC and MCM
- Memory – Controllers, embedded and specialty memories
- Sensors – CMOS image and IoT sensors and application-specific solutions
Test Equipment
Amkor has an extensive equipment fleet and continues to invest in new capabilities required to test the latest devices
Testers
- High-speed logic, mixed-signal, analog, high power and RF
- Probe pin data rate & current densities, economical parallelism
Prober
- Chuck planarity
- Loading force
- Position XY accuracy
- Rotational angle
- Temperature
- Wafer handling – 8” and 12” with 14, 10, 7 and 5 nm process technologies
- Warped wafer (reconstituted wafers)
Probe Card
- All docking types e.g. cable, pogo tower, direct dock
- In-line cleaning; Overdrive
- Multiple probe card technologies: Cantilever, vertical, pogo, membrane, MEMS & dual-level Chip-on-Wafer (CoW)
- Number of touchdowns
- Pin count per DUT; Pin-to-pin crosstalk; Per pin current capability
- Pin field planarity; Alignment accuracy
- Temperature tolerance
Test Locations
Our sites are strategically located near leading foundries, major customer sites and co-located to support probe with bump/WLCSP and test with assembly
Offerings
- Bumping, film frame test, package test, system level test, test development, wafer probe
Test Equipment
- V93000, FLEX, J750, Magnum, T5XXX, UFLEX
Packages
- Flip Chip, CSP, MicroLeadFrame®, PBGA, WLCSP
Markets
- Communications and Memory
Test Development Engineering
A fraction of the customers develop their own complete test solutions and offload to Amkor for production. Amkor can enable co-development, or full development, of complete test software and hardware solutions. Engage with us early in the product design for maximum impact or come to us later in the product lifecycle for significant cost savings with migrations to more cost-effective testers and/or higher parallelism.
Typical Test Development Cycle Times
Differentiated Test by Market
Amkor is the number one automotive OSAT, supporting worldwide supply chains. Products in this area include infotainment and safety requiring high levels of performance. This requires a much more comprehensive set of test requirements.
- Cold wafer probe and perform room & hot temperature final test
- High-quality, standards-compliant processes and systems
- Inspections and tri-temperature multi-temperature test capabilities
- Burn-in
- Final test at -55°C to +175°C
- System Level Test (SLT)
- Wafer probe at -55°C to +200°C
- Post assembly final test with outgoing post assembly opens/shorts testing, includes 2 and 4 wire resistance tests
Over 38% of Amkor’s revenue is derived from Communications (smartphones, tablets, handhelds and wearable devices). Our leading-edge test solutions keep pace with rapid changes in cellular and connectivity technology requirements. Amkor is already well-positioned for 5G wireless and its new test requirements working with leading customers and ATE suppliers, we have 5G RF test capability in place.
- 5G NR Conductive test for both FR1 and FR2 Frequency Ranges
- Asynchronous test for different RF connectivity standards
- ATE coverage with SLT (protocol test)
- ATE w/32 port and multi-site, multi-channel Tx & Rx support
- Complex SiP with simple SLT, including RF callbox testing
- Local RF shielding ≤60 dBm
- Multi-site x8 RF test to lower cost
- RF Front End (RFFE), SiP & IoT
- RF wafer probe capabilities – known good die (KGD) for WLCSP and known tested die (KTD) for SiP
- Single and multiple channel beamforming, phased array, AiP/AoP support
- SoC + Memory PoP – double side test/stack CSP – memory and logic test
Amkor is a leading provider of high-performance test solutions for the demanding networking and computing market – where five nines (99.999%) or higher uptime is expected. We have multiple customers supplying SiP(s), SoC(s) and components into these markets (servers, routers, switches, PCs, laptops and peripherals). Integral to these markets are storage technology and migrations from hard disk drives to solid-state drives (SSD). In addition, Amkor has a strong array of NAND test capabilities.
- Active thermal control for 300-watt products across tri-temperature in SLT and ATE test
- Distributed test (wafer probe, in-situ test between key assembly steps and final test (SLT and ATE) for 2.5D)
- Dynamic burn-in
- Film frame and strip test (x308 EEPROM)
- High-speed serial digital (e.g. PCIe Gen4, Gen5) testing up to 16 Gbps and 32 Gbps
- Probe solutions and wafer map management for Chip on Wafer (CoW)
- Silicon Photonics ICs
- Test during burn-in (TDBI)
Amkor is a leader in power discrete devices, with test services that are closely integrated with assembly flow for shorter cycle times and reduced costs. Unique requirements include:
- Adequate thermal capacity
- High current, high voltage
- Kelvin contact-type tests
- Low Rds_on
- SiC, GaN module test
High-volume products at Amkor include:
- Diodes
- Flip chip MOSFETs
- Intelligent power modules
- Insulated-Gate Bipolar Transistors (IGBT)
- Multi-voltage FETs
- Regulators and bipolar transistors for the automotive, power transmission and industrial segments
Products for today’s Internet of Things (IoT) and Industrial Internet of Things (IIoT) require an MCU, RF transmitter/receiver, sensors and actuators. The test solution needs to cover the conversion of physical real-world analog signals into electrical data and processing of the data to determine if the product is good or not.
Test Packages
Operations
- Interim process test/SLT
- O/S, KGD/Interposer, TSV test
- Package final test/SLT
Test Solution
- C/P: 50 µm pitch, >20K needles, >100A, tri-temp
- F/T: Tri-temp, ATC 300W
- O/S: 2/4 wires Kelvin
- SLT: 12 sites, ATC 300W
Current Products
- Logic + Memory + Si Interposer, 3D TSV HBM, HMC
- Mobile AP, CPU, GPU
- Networking, server
Questions?
Contact an Amkor expert by clicking the request info button below.