중간 전력 애플리케이션에 설계 유연성 제공

Amkor’s HSON8 package is optimized for medium power applications designed for low on-resistance and high-speed switching MOSFETs, found in motor drivers, injection drivers, power supply circuits, lamp drivers and automotive products. For design flexibility, the HSON8 power discrete package maintains the same 5 x 6 mm footprint area as the standard SOP8 package. To enhance thermal performance, it features an exposed die pad.

특징

  • Al wire bonding
  • Plating coverage at the tip of the lead is more than 50% of the leadframe thickness
  • wafer probe부터 테스트 및 패킹까지 Full turnkey 가능
  • 친환경 소재 - 무연도금 및 halogen-free 몰드 컴파운드 사용

Q & A

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