Plastic leadframe package designed for optimal IC performance

The Power Small Outline Package (PowerSOP® 3 or PSOP) is a leadframe based, plastic encapsulated package suited for applications requiring optimal performance in IC packaging. PSOPs utilize a thick copper heat slug to accommodate the needs of higher power devices. A green bill of materials is standard for Amkor’s PSOPs, allowing devices to meet applicable Pb-free and RoHS standards. New developments include leadframe roughening for improved Moisture Sensitivity Level (MSL) capability.


  • Cu wire interconnect for low cost
  • Standard JEDEC package outline
  • Multi-die production capability
  • Turnkey test services
  • Green materials are standard – Pb-free and RoHS compliant
  • Theta JC of under 1 °C/W can be achieved with optimal heatsinking
  • Highly conductive copper heat-slug and leadframes
  • PSOP3 has optional soft solder die attach for enhanced power capability


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