Trends and Challenges in Semiconductor Advanced Packaging
Amkor’s John Stone, EVP & Chief Sales Officer, will join fellow industry experts from Yole Développement and Semiconductor Industry Association to discuss “Trends and Challenges in Semiconductor Advanced Packaging” on September 29, 2020, at 11 AM EDT.
Innovations in how semiconductors are packaged have enabled the global semiconductor industry to achieve additional advancements on top of those traditionally gained during the “front-end” manufacturing process. Many packaging technologies exist today, and selecting the correct one is no longer an afterthought but an integral part of semiconductor manufacturing. For semiconductor firms known as OSATs that specialize in the “back-end” assembly, test, and packaging, the current environment poses both unique challenges and opportunities.