Samsung SAFE™ Forum 2021
Amkor Technology is pleased to be part of the Samsung Advanced Foundry Ecosystem (SAFE™) Virtual Forum being held on November 17-18, 2021.
Amkor’s Mike Kelly, VP, Advanced Package & Technology Integration will present “Heterogeneous IC Packaging” and discuss Amkor’s key packaging technologies that permit multiple chiplets to be integrated into a single product package. These end products include high-density, multi-die offerings which use a conventional IC package substrate and FCBGA packages, as well as stacked substrate packages. Amkor’s high-performance packaging portfolio uses key die and module fabrication technologies, combining a few or many die including logic, memory and more to enable the integration of chiplets and HBM designs, providing heterogeneous packaging solutions for advanced applications.