OFC Conference 2023
Amkor Technology invites you to join us at Optical Fiber Communication (OFC) Conference on March 5-9 at the San Diego Convention Center in San Diego, California.
Jon Aday, VP of Advanced Packaging Technology Integration at Amkor will be presenting “Tradeoffs in the Paths Forward for Advanced Packaging in Photonics” on Monday, March 6 at 3:00 PM.
Advanced semiconductor packaging is currently being used to support products that utilize photonics connections, but as we migrate from a wire-bonded solution to flip chip, the complexity increases dramatically. The fiber coupling methods will also impact the process flows and package structures that can be implemented. In his presentation, Jon will review the tradeoffs between the coupling methods and semiconductor packaging options as we migrate from pluggables to co-packaged optics.