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ISMP 2026

Amkor Technology will be attending the 24th International Symposium on Microelectronics Packaging (ISMP), a leading industry event focused on the latest developments in microelectronics packaging technologies, materials, processes, equipment, design and reliability. ISMP brings together semiconductor and electronics professionals from across the ecosystem to exchange ideas, share insights and explore emerging trends shaping the future of packaging innovation. The event will take place November 3–6, 2026, at Paradise Hotel Busan in Busan, Korea.

KyungRok Park, Corporate Vice President and Head of Global R&D Center, will deliver a keynote presentation, “Enabling the AI Era: Advanced Semiconductor Packaging as the Foundation for High-Performance Computing (HPC).” The session will examine how advanced packaging technologies are supporting the rapid evolution of AI, from generative and reasoning models to emerging agentic AI systems.

Amkor team members will be on-site throughout the symposium to connect with customers, partners and industry peers, discuss evolving packaging challenges and opportunities and engage in conversations about the technologies shaping the future of semiconductor innovation.

As a global leader in semiconductor packaging and test services, Amkor is committed to collaborating with customers, partners, and industry peers to strengthen the semiconductor ecosystem, foster innovation and support the technologies shaping the future while advancing what’s next.