Events

ISMP 2023

Amkor Technology invites you to join us at the 21^st International Symposium on Microelectronics and Packaging (ISMP 2023) on October 25-27, 2023, at Paradise Hotel in Busan, South Korea.

HeeJun Jang, Sr. Manager, Wafer Level Product Dev Project Leader at Amkor Korea, will present “S-Connect Platform (Bridge Technology) for Chiplet-based Large Module Packaging.”

SangHyun Jin, Director, Product Development at Amkor Korea, will be presenting “Advanced Material Solution for HDFO Package.”