Amkor Technology is pleased to present at ISMP 2021, held at Hanwha Resort in Busan, South Korea on November 3-5. This event will be Hybrid, both in-person and online sessions.
Amkor will be presenting the following:
“Complete EMI Shielding Leadless Package Solution in Automotive“, HyeongIl Jeon, AMF TFT Leader
“Heterogeneous 2.5D Integration Packaging Technology“, PilJe Sung, TSV Product Project Leader