Amkor Technology invites you to join us at the IMPACT 2022 Conference in Taipai, Taiwan at the Taipei Nangang Exhibition Center on October 26-28 and will be held in person. IMPACT 2022 Conference, which is organized by IEEE-EPS-Taipei, iMAPS-Taiwan, ITRI, and TPCA, is the largest gathering of PCB and IC packaging professionals in Taiwan.

Gabriel Chang, Project Sec. Manager, ATT APD III P1, Thermal & Mechanical Simulation Team at Amkor will be presenting, “LAB Flip Chip Reflow Process Robustness Prediction by Thermal Simulation.”

When: October 26, 2022 - October 28, 2022 Where: Taipei, Taiwan Location: Taipei Nangang Exhibition Center

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