Events

IMAPS Symposium 2026

Amkor Technology will participate in IMAPS Symposium 2026, the leading conference for microelectronics advanced packaging, taking place September 28–October 1, 2026, at Encore Boston Harbor in Boston, Massachusetts.

Organized by the International Microelectronics Assembly and Packaging Society, the 59th International Symposium on Microelectronics brings together a global community of packaging professionals and features one of the industry’s most comprehensive technical programs. As a proud gold sponsor, Amkor will share its expertise in advanced packaging through presentations that address some of the industry’s most critical technology challenges.

Hoon Jung, Senior Director of Amkor’s Chiplets/FCBGA Business Unit, will present “Takeaway and Assignment of Packaging Technology for Heterogeneous + Large Body Size,” exploring how advanced packaging is extending Moore’s Law through heterogeneous integration. His session will examine the growing adoption of large-format, high-performance packages and the associated challenges of thermal management, signal integrity, power delivery, warpage, and design complexity.

Woongpyo Lee, Senior Director and Advanced Interconnection Project Leader, will present “Mitigating Thermal Stress and Warpage in Heterogeneous Chiplet Integration Using Reverse Laser Thermo-Compression Bonding (R-LTC),” highlighting an innovative bonding approach designed for next-generation 2.5D and 3D integration. The presentation will demonstrate how R-LTC technology improves thermal uniformity, reduces chiplet-side stress, and enhances reliability through effective warpage control.

Through collaboration with customers, industry partners, and the broader microelectronics community, Amkor continues to advance packaging innovation, address complex technology challenges, and help enable the next generation of semiconductor solutions while advancing what’s next.