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IMAPS Symposium 2026

Amkor Technology will participate in IMAPS Symposium 2026, the top conference for microelectronics advanced packaging. The conference will be held September 28–October 1, 2026, at Encore Boston Harbor in Boston, Massachusetts.

Organized by the International Microelectronics Assembly and Packaging Society, the 59th International Symposium on Microelectronics brings together a broad community of packaging professionals for one of the industry’s most robust technical programs. Amkor is proud to serve as a gold sponsor of this event.

As part of the conference program, Hoon Jung, Senior Director, Chiplets/FCBGA BU, will present “Takeaway and Assignment of Packaging Technology for Heterogenous + Large Body Size,” and Woongpyo Lee, Senior Director, Adv. Interconnection Project Leader, will present “Mitigating Thermal Stress and Warpage in Heterogeneous Chiplet Integration Using Reverse Laser Thermo-Compression Bonding (R-LTC).” These sessions will highlight key challenges and advances in heterogeneous integration, thermal reliability, and next-generation packaging technologies.

Amkor looks forward to engaging with customers, industry partners, and attendees at IMAPS Symposium 2026 to share insights and discuss the future of advanced packaging.