IEEE VLSI Test Symposium
Join Amkor Technology for the IEEE VLSI Test Symposium virtual event on April 25 – 27, 2022.
Vineet Pancholi, Sr. Director, Test Technology at Amkor will present “Test Impact of Multi-Die Packages” on Wednesday, April 27 from 9:10 – 9:30 AM. In his presentation, he will discuss how electrical, mechanical and thermal constraints of chiplets impact the package assembly #technology and how these, in turn, impact the challenges of package-level testing.
When: April 25, 2022 - April 27, 2022 Where: VIRTUAL Location: VIRTUAL