European 3D Summit 2018
This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
Steffen Kroehnert, Sr Director, Director, Advanced Packaging Technology, will be presenting “The Expanding Reach of Interposer Technology” on Tuesday, January 23 at 14:10.
Embedded packaging and Wafer Level Fan-Out Technology with Chip-first/RDL-last assembly and an interconnect approach for low and high density active and passive interposers as well as advanced Flip Chip Technology with RDL-first/Chip-last assembly and interconnect approach are gaining importance in the semiconductor packaging market. These advanced packaging options are providing significant performance, form-factor and cost advantages compared to mainstream packaging technologies. The different assembly and interconnect approaches serve different application needs, and allow for 3D integration such as WL3D and WLPoP. This presentation will discuss Amkor Technology’s offerings in this area, including: SWIFT® (Silicon Wafer Integrated Fan-Out Technology), WLFO (Wafer Level Fan-Out) based on eWLB (embedded Wafer Level Ball Grid Array) and 2.5D silicon interposers, providing a complete set of advanced packaging technologies to create innovative packaging solutions to meet customer needs – today and into the future.