Amkor Technology invites you to join us at ECTC 2023 on May 30-June 2 in Orlando, Florida at the JW Marriott Orlando. ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange.
Amkor is presenting the following:
“Electromigration Performance of Fine-Line Cu Redistribution Layer (RDL) for High-Density Fan-Out Packaging”
JiHye Kwon, JeongMin Ju, SangHyuk Kim, EunSook Sohn, JinYoung Khim – Amkor Technology Korea
“Package Integrated Vapor Chamber Heat Spreaders”
Cameron Nelson, SangHyuk Kim – Amkor Technology and Amkor Technology Korea
“Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging”
Mike Kelly, Dave Hiner, Wonchul Do, Heejun Jang, Kyun Ahn, Gamhan Yong, Jihyun Kim, YeonKi Jeong, EunSook Sohn, Taekyeong Hwang, JinYoung Khim – Amkor Technology and Amkor Technology Korea
Amkor will be exhibiting at Booth #215 with our packaging experts on hand to answer questions and discuss your IC packaging needs.