Amkor Technology invites you to the 4th International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) on February 1-3. 2023 at the Florida International University in Miami, Florida. Amkor is a proud Diamond sponsor of this event.
Mahadevan (Devan) Iyer, PhD, VP, Mainstream Advanced Packaging Integration at Amkor will be presenting “Emerging Power Electronics Packaging and System Integration for Automotive Applications”.
Semiconductor power devices and modules are critical components of power electronics in electrified automotive vehicles. The building blocks of automotive power electronics, key drivers for power packaging, and design/materials/process considerations for power modules will be discussed in this talk. Emerging automotive power trends and key technical challenges associated with power module design and fabrication will be presented. System integration concepts and a few of the promising trends for automotive applications will also be discussed as a part of this presentation.