시장에서 가장 광범위한 flip chip 패키지
솔루션

Amkor is committed to being the leading provider of Flip Chip in Package (FCiP) technology. By partnering with proven industry leaders, Amkor has brought high volume flip chip packaging and assembly to the subcontract market. FCBGA, fcLBGA, fcLGA, FlipStack® CSP and fcCSP packages are qualified and in production. Flip chip production capability exists in our Portugal, Philippines, Korea, Taiwan, and China factories. Wafer bumping, wafer level packaging (WLP) and flip chip packaging solutions are qualified in lead-free options.

flip chip interconnect 는 아래와 같은 장점이 있습니다.

  • Reduced signal inductance – Because the interconnect is much shorter in length (0.1 mm vs. 1–5 mm), the inductance of the signal path is greatly reduced. This is a key factor in high-speed communication and switching devices
  • Reduced power/ground inductance – By using flip chip interconnect, power can be brought directly into the core of the die, rather than requiring rerouting to the edges. This greatly decreases the noise of the core power, improving the performance of the silicon
  • 다이 크기 축소 – pad에 의해 제약을 받는 다이(bond pad에 필요한 edge 공간으로 크기가 결정됨)의 경우 다이 크기를 줄여 실리콘 비용을 절감합니다.

  • Higher signal density – Rather than edge only, the entire surface of the die can be used for interconnect. This is similar to the comparison between QFP and BGA packages. Because flip chip can connect over the surface of the die, it can support larger numbers of interconnects on the same die size
  • 패키지 footprint 감소 – 경우에 따라 flip chip을 사용하여 전체 패키지 크기를 줄일 수 있습니다. 이는 다이에서 패키지 edge까지 필요한 공간을 줄이거나 (배선에 추가 공간이 필요하지 않기 때문에) 또는 higher density substrate 기술을 사용함으로써 달성할 수 있는데, 이를 통해 패키지 pitch를 줄일 수 있기 때문입니다.

Q & A

앰코에 대해 궁금한 점이 있다면 하단의 ‘문의하기’를 클릭하세요.