热效率，满足高性能需求
Amkor’s ExposedPad LQFP/TQFP family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. These packages can increase heat dissipation by as much as 110% over standard LQFP/TQFP packages, thereby expanding the margin of operating parameters.
In addition, the ExposedPad can be connected to ground, thereby reducing loop inductance for high frequency applications. The ExposedPad should be soldered directly to the PCB to realize the thermal and electrical benefits. 3D packaging with the die stack process is also provided in this package for the MCP solution.
- 5 x 5 毫米至 28 x 28 毫米封装尺寸
- 32-256 个引脚数量
- 大量晶粒垫板尺寸选项
- 双下置接地阻抗环形垫板
- 适用于 TQFP 的 1.0 毫米封装厚度
- 适用于 LQFP 的 1.4 毫米封装厚度
- 定制引脚框架设计
- ExposedPad is easily inverted for heat sink attachment
- 薄型 – <1.2 毫米最大贴装高度
- Electrical – Very low loop inductance with the use of a paddle as a ground path, more pins available for signal and allows for operating frequencies of up to 2.4 GHz
As increased end-application densities and shrinking product sizes demand more from IC packages, ExposedPad LQFP/TQFP packages provide designers with the necessary margin for designing and producing high-performing products.
Applications such as automotive (engine control units, powertrain and infotainment controllers), LCD/flat panel TVs and telecom benefit from this package. High-speed silicon technologies work especially well in ExposedPad LQFP/TQFP packages due to grounding capabilities.
Amkor devices are assembled in optimized package designs with proven, reliable semiconductor materials.
Commercial Reliability Test
- Moisture sensitivity characterization: JEDEC level 3, 30°C/60% RH, 192 hrs, 3x reflow – SAT
- uHAST w/ precon: 130°C/85% RH, 96 hours f Temp cycle “C” w/ precon: -65°C/+150°C, 500 cycles
- High temp storage: 150°C, 1000 hours
- Qualified to automotive AECQ100 and AECQ006 standards at grade 1 and grade 0 levels
- Die thickness: 11.5 ± .5 mils, 14.5 ± 0.5 mils for LQFP
- Bond pad pitch: 0.050 mm
- Wire diameter: 0.8 mil Cu wire standard
- Lead finish: 100% Matte Sn standard, NiPD PPF frames available
- Marking: Laser
- Pack/Ship options: Barcode, dry pack
- Wafer backgrinding available
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