Thermal efficiency for high-performance demands

This Amkor developed family of power IC packages significantly increases the thermal efficiency of power constrained standard Low-Profile Quad Flat Pack (LQFP) and Thin Quad Flat Pack (TQFP) packages. Exposed (ePad) LQFP/TQFP (also known as HLQFP/HTQFP) can increase heat dissipation by as much as 110% over a standard LQFP/TQFP, expanding the margin of operating parameters. ePad can also be connected to a ground, reducing loop inductance for high-frequency applications. For a multi-chip solution, 3D packaging with die stack process is also available.

ePad LQFP/TQFP는 통신, 스토리지, 무선, 네트워킹, PC, 자동차 및 기타 유사한 애플리케이션을 포함한 고성능 제품을 설계하고 생산하는 데 필요한 margin을 설계자에게 제공합니다. 갈륨비소 화합물 반도체와 고속 실리콘 기술은 차폐 및 접지 기능이 추가되어 ePad LQFP/TQFP 패키지에서 효과적으로 작동합니다.


  • 5 x 5mm에서 28 x 28mm의 패키지 크기
  • 32–256의 lead 개수
  • A broad selection of die pad sizes
  • Double down-set ground bond ring pad
  • Copper leadframes
  • TQFP 제품 두께 1.0mm
  • LQFP 제품 두께 1.4mm
  • 고객맞춤형 leadframe 설계 가능
  • ExposedPad is easily inverted for heat sink attach
  • Low profile – <1.2 mm max mounted height
  • Electrical – Very low loop inductance with use of paddle as a ground path, more pins available for signal and allows for operating frequencies of up to 2.4 GHz

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