혁신적인 form factor를 위한 고밀도, 복합 적층 조합 솔루션

The FlipStack® CSP utilizes Amkor’s industry-leading ChipArray® BGA (CABGA) manufacturing capabilities, in combination with Amkor’s flip chip CSP (fcCSP) technology.

FlipStack CSP technology enables the stacking of a wide range of different semiconductor devices to deliver the high level of silicon integration and area efficiency required in portable multimedia products. This extensive high-volume infrastructure enables the rapid deployment of advances in die stacking technology across multiple products and factories to achieve the lowest total cost.

FlipStack CSP uses high-density thin core substrates, advanced wafer thinning, die attach, flip chip and wire bonding capabilities to stack multiple devices in a conventional fine-pitch ball grid array (FBGA) surface mount package. Many customers have relied on Amkor to solve their highest density and most complex device stack combinations.

Portable multi-media devices including cell phones, digital cameras, PDAs and audio players employ FlipStack CSP solutions to address a range of design requirements such as lower cost and smaller, lighter and more innovative new product form factors. Additional applications include gaming, automotive and computing.

특징

  • 4–15mm의 패키지 크기
  • Package height down to 0.6mm
  • Design, assembly and test capabilities that enable stacking combinations of memory, logic and mixed signal type devices in I/O counts from 50 to 1100
  • Established package infrastructure with standard CABGA and fcCSP footprints
  • Consistent product performance with high yields and reliability

  • Die overhang wire bonding
  • Low loop wire bonding less than 40μm
  • Wafer thinning: wire bond to 40μm, bumped wafer to 75μm, cu pillar bumped wafer to 50μm
  • 무연, 유해물질규제 (RoHS) 및 친환경 준수
  • Passive component integration options
  • JEDEC Standard Outlines including MO-192, MO-195, MO-216, MO-219 and MO-298

Q & A

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