关于 AI、机器学习与深度学习的 SEMI Arizona Breakfast Forum
Amkor and the SEMI Arizona Chapter invite you to the SEMI Arizona Breakfast Forum at the Amkor corporate office in Tempe on Friday, Oct 19th starting at 7:30 AM. Hear local industry experts discuss Artificial Intelligence, Machine Learning, & Deep Learning Applications.
The wave of new ICs and IoT devices to support artificial intelligence (AI) applications is sweeping across the microelectronics industry. The Arizona Breakfast Forum will feature:
- Future device packaging technical roadmap of materials and processes for AI devices
- An introduction to machine-learning technology
- AI market growth forecasts highlighting lucrative business opportunities for the overall supply chain
- A demonstration of the PARADE bomb disposal robot.
This event offers an ideal networking opportunity for industry, academia and student professionals.
Be sure to take a look at the ASU Student Posters on display during the breakfast, break, and after the presentations.
Agenda for Friday, October 19th
|
8:15
|
Keynote: Packaging Technology to Enable the Future
Ron Huemoeller
Corporate VP – R&D, Amkor |
|
8:50
|
Taking AI to the Edge
Jim McGregor
Founder and Principal Analyst, TIRIAS Research
|
|
9:50
|
Machine Learning Methods and Their Sensor, IoT Applications
Prof. Andreas Spanias
School of Electrical, Computer and Energy Engineering, ASU
|
|
10:20
|
High-Performance Packaging for Deep Learning Applications
Mike Kelly
VP – Advanced Package and Technology Integration, Amkor |
Robotics Demonstrations
| 10:50 | “PARADE” bomb disposal robot demonstration presented by Rossum Rumblers, Polytechnic Robotics Club, ASU-Live Robot Demo Defusing a Mock I.E.D.
Robotics/NASA, ASU-Static display of their Submersible Robot |
When: October 19, 2018
Where: Tempe, Arizona
Location: Amkor Technology Corporate Office
更多未来大事件
2024 年第 2 季度的 Amkor Technology 财报电话会议
IEEE ESTC 2024
