SEMI Arizona Breakfast Forum on AI, Machine Learning, & Deep Learning

Amkor and the SEMI Arizona Chapter invite you to the SEMI Arizona Breakfast Forum at the Amkor corporate office in Tempe on Friday, Oct 19th starting at 7:30 AM. Hear local industry experts discuss Artificial Intelligence, Machine Learning, & Deep Learning Applications.

The wave of new ICs and IoT devices to support artificial intelligence (AI) applications is sweeping across the microelectronics industry. The Arizona Breakfast Forum will feature:

  • Future device packaging technical roadmap of materials and processes for AI devices
  • An introduction to machine-learning technology
  • AI market growth forecasts highlighting lucrative business opportunities for the overall supply chain
  • A demonstration of the PARADE bomb disposal robot.

This event offers an ideal networking opportunity for industry, academia and student professionals.

Be sure to take a look at the ASU Student Posters on display during the breakfast, break, and after the presentations.

Agenda for Friday, October 19th   
 
8:15 
Keynote: Packaging Technology to Enable the Future
Ron Huemoeller
Corporate VP – R&D, Amkor
8:50 
Taking AI to the Edge
Jim McGregor
Founder and Principal Analyst, TIRIAS Research
9:50 
Machine Learning Methods and Their Sensor, IoT Applications
Prof. Andreas Spanias
School of Electrical, Computer and Energy Engineering, ASU
10:20 
High-Performance Packaging for Deep Learning Applications
Mike Kelly
VP – Advanced Package and Technology Integration, Amkor

 

Robotics Demonstrations
10:50   “PARADE” bomb disposal robot demonstration presented by Rossum Rumblers, Polytechnic Robotics Club, ASU-Live Robot Demo Defusing a Mock I.E.D.

Robotics/NASA, ASU-Static display of their Submersible Robot 

When: October 19, 2018 Where: Tempe, Arizona Location: Amkor Technology Corporate Office

近日開催予定のイベント

IMAPS Symposium 2024

Packaging Chips with CHIPS: West Coast Summit

IEMT 2024