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NEPCON Japan IC & Sensor Packaging Technology Expo

Amkor Technology invites you to join us at the NEPCON Japan IC & Sensor Packaging Technology Expo on January 24 – 26 at the Tokyo Big Sight in Tokyo, Japan.

TaeKyeong Hwang, Vice President of R&D Product Development Manager at Amkor Technology Korea, will present “2.5D/3D Advanced Package Platform Guide.”

摘要：

Emphasizing the significance of semiconductor backend processes (packaging), recent efforts have aimed to address limitations in device chip design and manufacturing. This presentation introduces various advanced packaging platforms and outlines the standards for device chip design procedures.