KPIA-JKC Packaging Seminar

Amkor Technology invites you to join us at the KPIA-JKC Packaging Seminar on October 25-26 in Seoul, South Korea at the COEX Hall C&D1. YoungDo Kweon, Sr. Director, Chiplets/FCBGA Development at Amkor, will present on “High-Performance TIM for HPC and Data Center Semiconductor.

时间:2023 年 10 月 25 日 - 2023 年 10 月 26 日 场地:COEX Hall C&D1 地点:韩国首尔

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