活动

KPIA-JKC Packaging Seminar

Amkor Technology invites you to join us at the KPIA-JKC Packaging Seminar on October 25-26 in Seoul, South Korea at the COEX Hall C&D1. YoungDo Kweon, Sr. Director, Chiplets/FCBGA Development at Amkor, will present on “High-Performance TIM for HPC and Data Center Semiconductor.“