Amkor Technology invites you to join us at the KPIA-JKC Packaging Seminar on October 25-26 in Seoul, South Korea at the COEX Hall C&D1. YoungDo Kweon, Sr. Director, Chiplets/FCBGA Development at Amkor, will present on “High-Performance TIM for HPC and Data Center Semiconductor.

開催日:2023年10月25日~2023年10月26日 会場:COEX Hall C&D1 開催地:韓国・ソウル


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