ISMP 2019

Amkor Technology is pleased to be presenting at ISMP 2019, being held within SEDEX 2019 in Seoul on October 8-11.

SungSoon Park, Sr. Director – R&D System Projects at Amkor Technology will be presenting “Advanced Packaging Technology for 5G, AI and Automotive”.

When: October 8, 2019 - October 11, 2019 Where: Seoul, South Korea Location: COEX Convention Center

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SEMICON Taiwan 2019

NEPCON Nagoya 2019

European MEMS & Sensors Summit