ISMP 2019
Amkor Technology is pleased to be presenting at ISMP 2019, being held within SEDEX 2019 in Seoul on October 8-11.
SungSoon Park, Sr. Director – R&D System Projects at Amkor Technology will be presenting “Advanced Packaging Technology for 5G, AI and Automotive”.
When: October 8, 2019 - October 11, 2019
地点： 韩国首尔
Location: COEX Convention Center
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